Intel and TSMC compete between speed and semiconductor density

According to a report from TechInsights , the TSMC N2 semiconductor chip manufacturing process has achieved a transistor density of 313 million per square millimeter, higher than Intel 18A (238 million) and Samsung SF3 (231 million). However, density is not the only factor that determines the efficiency of a process, because chip design also depends on how different types of transistor cells are combined.

Intel và TSMC cạnh tranh giữa tốc độ và mật độ bán dẫn- Ảnh 1.

With higher transistor density, TSMC N2 enables the production of more compact microprocessors, optimizing silicon space and expanding the ability to integrate components on the microprocessor.

In terms of performance, Intel 18A could offer a significant improvement over previous generations, but current assessments are based on estimates rather than actual data. The key differentiator for Intel 18A is PowerVia technology, a back-side power delivery system that increases speed and power efficiency. TSMC is expected to implement similar technology in the future, but the first version of the N2 does not have this feature integrated. Notably, not all Intel 18A chips use PowerVia, depending on the design requirements of each product.

In terms of power consumption, analysts predict that TSMC N2 will be more efficient than Intel 18A and Samsung SF3. TSMC has maintained an advantage in power efficiency over many process generations and this may continue with N2.

Intel và TSMC cạnh tranh giữa tốc độ và mật độ bán dẫn- Ảnh 2.

Intel 18A process aims for higher processing speed by improving the current architecture instead of increasing the number of transistors

The timing difference is also important. Intel plans to start mass production of 18A in mid-2025 for its next-generation Core Ultra processors, with commercial products expected by the end of the year. TSMC’s N2 process, meanwhile, is expected to enter mass production in late 2025, meaning N2-based products may not be available until mid-2026.

Overall, TSMC N2 has the advantage in transistor density, while Intel 18A may have a slight edge in performance thanks to PowerVia technology. In addition, Intel has the advantage in launch time, helping it bring commercial products to users sooner than its competitors.

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